Utilize este identificador para referenciar este registo: http://hdl.handle.net/20.500.11960/4852
Título: Structural analysis of selective laser melted copper-tin alloy
Autores: Rahmani, Ramin
Resende, Pedro
Couto, Rúben
Lopes, Sérgio I.
Kumar, Rahul
Maurya, Himanshu S.
Karimi, Javad
Afonso, Alexandre M.
Hussain, Abrar
Abrantes, João C. C.
Palavras-chave: Copper alloys
Thermal conductivity
Electrical conductivity
Selective laser melting
Additive manufacturing
Data: 2024
Citação: Rahmani, R., Resende, P. R., Couto, R., Lopes, S. I., Kumar, R., Maurya, H. S., Karimi, J., Afonso, A. M., Hussain, A., & Abrantes, J. C.C. (2024). Structural analysis of selective laser melted copper-tin alloy. Journal of Alloys and Metallurgical Systems, 7, Artigo e100097. https://doi.org/10.1016/j.jalmes.2024.100097
Resumo: Additively manufactured complex geometries from copper alloys with high thermal and mechanical properties have drawn the attention of researchers. The present contribution explores the additive manufacturing (AM) of copper-based alloys from powder particles intended for heat sink and heat exchange applications. Selective laser melting (SLM) parameters featuring low laser beam power (160 W), moderate scanning speed (320 mm/s), and high energy density (200 J/mm³) were employed to fabricate dense components from CuSn10 particles. The present work deal with structural analysis and precision investigation of microfabrication, particularly in Struts, Tubes, and Fins. Mechanical properties (compression and hardness) for Strut structure, differential pressure evaluations for Tube structure, and analyses of thermal and electrical conductivities for Fin structure were investigated. The results showed an improvement in strength compared to those of pure copper, facilitating ease of AM. The obtained results affirm the feasibility of AM, demonstrating the successful creation of complex and combined solid-porous structures using SLM process from Cu alloys. A comprehensive structural investigation and characterization of the Cu–Sn alloy is presented here, aiming to establish a standardized approach for analysing Cu alloys. The results indicate that small-scaled structures fabricated via CuSn10 alloy exhibits a thermal conductivity of 34.3 W·m⁻¹·K⁻¹, an electrical conductivity of 4.72×10⁶ S/m, a hardness of 119 HV-50, a uniform surface roughness of 6 µm, and can withstand a force loading of 1 kN.
URI: http://hdl.handle.net/20.500.11960/4852
ISSN: 2949-9178
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